On May 19, 2020, in Munich, Germany and Boca Raton, Florida (GLOBE NEWSWIRE), sensor solutions provider HENSOLDT and leading 3D printed electronics (AME)/printed electronics (PE) supplier Nano Dimension cooperated, using 3D Major breakthroughs have been made in the development of high-performance electronic components in printing technology. Using Nano Dimension's newly developed dielectric polymer inks and conductive inks, HENSOLDT successfully assembled the world's first 10-layer 3D printed circuit board (PCB) with high-performance electronic structures welded on both sides of the board. . Before that, 3D printed circuit boards could not withstand the soldering process of double-sided components.
"Military sensor solutions require much higher performance and reliability levels than commercial components," said Thomas Müller, CEO of HENSOLDT. "Through 3D printing, high-density components can be obtained faster with less workload, giving us a competitive advantage in the development of such high-end electronic systems."
"The partnership between Nano Dimension and HENSOLDT is our ideal type of customer cooperation," commented Yoav Stern, President and CEO of Nano Dimension. "The cooperation and learning with HENSOLDT has enabled us to achieve an unprecedented in-depth understanding of polymer material applications. In addition, it also guided us to develop Hi-PED (High-Performance Electronic Devices), achieving uniqueness in the shortest time to market The application of this creates a competitive advantage."
Electronic circuit 3D printing technology is very useful to verify the functions of new designs and special electronic components before production. It is a highly agile and personalized engineering method for new electronic circuit prototype design. This greatly reduces the time and cost of the development process. In addition, a verified and approved design can be provided before production starts, thereby improving the quality of the final product.
The revolutionary method of additive manufacturing of multiple materials at the same time can help redefine the attributes of future electronic products, including density, size and flexibility. There are at least two print heads, one for nano-silver conductive ink and the other for dielectric polymer ink. Allow DragonFly LDM to print using two inks simultaneously in a single 3D printing job.
However, when performing 3D printing of multilayer circuits, problems such as the design direction of the circuit and the direct separation distance between layers will cause a lot of problems. Therefore, the breakthrough of the 10-layer 3D printed circuit is a new milestone.
1. Free innovation, not restricted by traditional manufacturing processes.
2. 3D print all parts of the circuit design for dynamic testing.
3. Through holes and through holes can be created without drilling or plating. It only takes a few hours to print electronic circuits inside.
4. By combining the design of complex geometric shapes and new functions, while saving space, weight and cost, innovation is also carried out.
5. Simplified work flow and simple operation. Long-term uninterrupted 3D printing can be unattended.
The above information is provided by PCB supplier.
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