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Technologies

Jun. 23, 2020
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products:1 - 50 layer
board finishing types:HAL leadfree, ENIG, Immersion Silver, Immersion Tin, OSP
hard gold: < 1 µ
gold fingers: > 0.75 µ
carbon ink
tin min.: 0.60 µ
max.: 1,19 µ
base material:FR 2, FR 4, CEM 1, CEM 3, Rogers, Nelco, PTFE
flex, alu – 8 W / mK
hole size tolerance:PTH: +/- 0.076 mm
NPTH: +/- 0.05 mm
min. finished hole:0.1 mm
blind/buried holes:0.30 mm
hole to hole tolerance:+/- 0.076 mm
board thickness:≤ 6 mm
line width/spacing:≤ 0.075 mmm
line width tolerance:+/- 15 %
line space tolerance:+/- 20 %
SMT pitch:0.20 mm
electrical testing:test voltage: 50 - 250 V
nickel plating thickness:min.: 2.54 µ
max.: 7.60 µ
soldermask thickness:4 - 50 µm
soldermask ink:different colours
board thickness tolerance:+/- 10 %
outline tolerance:+/- 0.1 mm
V-grooving tolerance:+/- 0.1 mm
min. soldermask pitch:0.1 mm
base copper thickness:18 - 400 µ
flammability:94 V - 0
thermal stress:288° C / 20 sec
outline profile:punching, routing, v-cut
through-hole resistance:< 300 ohm normal
twist and bow:< 2 %
maximum panel size:476 mm x 620 mm


Technologies

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